Are We There Yet? – Use Cases and Requirements for the Industrial Metaverse
F. Heimann, O.U. Wetter, P. Wette, in: 2024 IEEE/ACM Symposium on Edge Computing (SEC), IEEE, 2024, pp. 402–409.
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Konferenzbeitrag
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Titel des Konferenzbandes
2024 IEEE/ACM Symposium on Edge Computing (SEC)
Seite
402-409
Konferenz
2024 IEEE/ACM Symposium on Edge Computing (SEC)
Konferenzort
Rome, Italy
Konferenzdatum
2024-12-04 – 2024-12-07
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Heimann, Florian ; Wetter, Oliver Utz ; Wette, Philip: Are We There Yet? – Use Cases and Requirements for the Industrial Metaverse. In: 2024 IEEE/ACM Symposium on Edge Computing (SEC) : IEEE, 2024, S. 402–409
Heimann F, Wetter OU, Wette P. Are We There Yet? – Use Cases and Requirements for the Industrial Metaverse. In: 2024 IEEE/ACM Symposium on Edge Computing (SEC). IEEE; 2024:402-409. doi:10.1109/SEC62691.2024.00044
Heimann, F., Wetter, O. U., & Wette, P. (2024). Are We There Yet? – Use Cases and Requirements for the Industrial Metaverse. In 2024 IEEE/ACM Symposium on Edge Computing (SEC) (pp. 402–409). Rome, Italy: IEEE. https://doi.org/10.1109/SEC62691.2024.00044
@inproceedings{Heimann_Wetter_Wette_2024, title={Are We There Yet? – Use Cases and Requirements for the Industrial Metaverse}, DOI={10.1109/SEC62691.2024.00044}, booktitle={2024 IEEE/ACM Symposium on Edge Computing (SEC)}, publisher={IEEE}, author={Heimann, Florian and Wetter, Oliver Utz and Wette, Philip}, year={2024}, pages={402–409} }
Heimann, Florian, Oliver Utz Wetter, and Philip Wette. “Are We There Yet? – Use Cases and Requirements for the Industrial Metaverse.” In 2024 IEEE/ACM Symposium on Edge Computing (SEC), 402–9. IEEE, 2024. https://doi.org/10.1109/SEC62691.2024.00044.
F. Heimann, O. U. Wetter, and P. Wette, “Are We There Yet? – Use Cases and Requirements for the Industrial Metaverse,” in 2024 IEEE/ACM Symposium on Edge Computing (SEC), Rome, Italy, 2024, pp. 402–409.
Heimann, Florian, et al. “Are We There Yet? – Use Cases and Requirements for the Industrial Metaverse.” 2024 IEEE/ACM Symposium on Edge Computing (SEC), IEEE, 2024, pp. 402–09, doi:10.1109/SEC62691.2024.00044.
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