Evaluation of interconnect fabrics for an embedded MPSoC in 28 nm FD-SOI
G. Sievers, J. Ax, N. Kucza, M. Flaskamp, T. Jungeblut, W. Kelly, M. Porrmann, U. Rückert, in: 2015 IEEE International Symposium on Circuits and Systems (ISCAS), IEEE, 2015, pp. 1925–1928.
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Konferenzbeitrag
| Veröffentlicht
| Englisch
Autor*in
Sievers, Gregor;
Ax, Johannes;
Kucza, Nils;
Flaskamp, Martin;
Jungeblut, Thorsten
;
Kelly, Wayne;
Porrmann, Mario;
Rückert, Ulrich
;
Kelly, Wayne;
Porrmann, Mario;
Rückert, UlrichErscheinungsjahr
Titel des Konferenzbandes
2015 IEEE International Symposium on Circuits and Systems (ISCAS)
Seite
1925-1928
Konferenz
2015 IEEE International Symposium on Circuits and Systems (ISCAS)
Konferenzort
Lisbon, Portugal
Konferenzdatum
2015-05-24 – 2015-05-27
FH-PUB-ID
Zitieren
Sievers, Gregor ; Ax, Johannes ; Kucza, Nils ; Flaskamp, Martin ; Jungeblut, Thorsten ; Kelly, Wayne ; Porrmann, Mario ; Rückert, Ulrich: Evaluation of interconnect fabrics for an embedded MPSoC in 28 nm FD-SOI. In: 2015 IEEE International Symposium on Circuits and Systems (ISCAS) : IEEE, 2015, S. 1925–1928
Sievers G, Ax J, Kucza N, et al. Evaluation of interconnect fabrics for an embedded MPSoC in 28 nm FD-SOI. In: 2015 IEEE International Symposium on Circuits and Systems (ISCAS). IEEE; 2015:1925-1928. doi:10.1109/ISCAS.2015.7169049
Sievers, G., Ax, J., Kucza, N., Flaskamp, M., Jungeblut, T., Kelly, W., … Rückert, U. (2015). Evaluation of interconnect fabrics for an embedded MPSoC in 28 nm FD-SOI. In 2015 IEEE International Symposium on Circuits and Systems (ISCAS) (pp. 1925–1928). Lisbon, Portugal: IEEE. https://doi.org/10.1109/ISCAS.2015.7169049
@inproceedings{Sievers_Ax_Kucza_Flaskamp_Jungeblut_Kelly_Porrmann_Rückert_2015, title={Evaluation of interconnect fabrics for an embedded MPSoC in 28 nm FD-SOI}, DOI={10.1109/ISCAS.2015.7169049}, booktitle={2015 IEEE International Symposium on Circuits and Systems (ISCAS)}, publisher={IEEE}, author={Sievers, Gregor and Ax, Johannes and Kucza, Nils and Flaskamp, Martin and Jungeblut, Thorsten and Kelly, Wayne and Porrmann, Mario and Rückert, Ulrich}, year={2015}, pages={1925–1928} }
Sievers, Gregor, Johannes Ax, Nils Kucza, Martin Flaskamp, Thorsten Jungeblut, Wayne Kelly, Mario Porrmann, and Ulrich Rückert. “Evaluation of Interconnect Fabrics for an Embedded MPSoC in 28 Nm FD-SOI.” In 2015 IEEE International Symposium on Circuits and Systems (ISCAS), 1925–28. IEEE, 2015. https://doi.org/10.1109/ISCAS.2015.7169049.
G. Sievers et al., “Evaluation of interconnect fabrics for an embedded MPSoC in 28 nm FD-SOI,” in 2015 IEEE International Symposium on Circuits and Systems (ISCAS), Lisbon, Portugal, 2015, pp. 1925–1928.
Sievers, Gregor, et al. “Evaluation of Interconnect Fabrics for an Embedded MPSoC in 28 Nm FD-SOI.” 2015 IEEE International Symposium on Circuits and Systems (ISCAS), IEEE, 2015, pp. 1925–28, doi:10.1109/ISCAS.2015.7169049.
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