{"publication_status":"published","year":"1999","date_created":"2023-09-01T10:05:42Z","title":"W/Si multilayers deposited by hot-filament MOCVD","publication":"Thin Solid Films","citation":{"apa":"Hamelmann, F., Petri, S. H. A., Klipp, A., Haindl, G., Hartwich, J., Dreeskornfeld, L., … Heinzmann, U. (1999). W/Si multilayers deposited by hot-filament MOCVD. <i>Thin Solid Films</i>, <i>338</i>(1–2), 70–74. <a href=\"https://doi.org/10.1016/S0040-6090(98)00996-1\">https://doi.org/10.1016/S0040-6090(98)00996-1</a>","chicago":"Hamelmann, Frank, S.H.A. Petri, A. Klipp, G. Haindl, J. Hartwich, L. Dreeskornfeld, U. Kleineberg, P. Jutzi, and U. Heinzmann. “W/Si Multilayers Deposited by Hot-Filament MOCVD.” <i>Thin Solid Films</i> 338, no. 1–2 (1999): 70–74. <a href=\"https://doi.org/10.1016/S0040-6090(98)00996-1\">https://doi.org/10.1016/S0040-6090(98)00996-1</a>.","ieee":"F. Hamelmann <i>et al.</i>, “W/Si multilayers deposited by hot-filament MOCVD,” <i>Thin Solid Films</i>, vol. 338, no. 1–2, pp. 70–74, 1999.","short":"F. Hamelmann, S.H.A. Petri, A. Klipp, G. Haindl, J. Hartwich, L. Dreeskornfeld, U. Kleineberg, P. Jutzi, U. Heinzmann, Thin Solid Films 338 (1999) 70–74.","alphadin":"<span style=\"font-variant:small-caps;\"><span style=\"font-variant:small-caps;\">Hamelmann, Frank</span> ; <span style=\"font-variant:small-caps;\">Petri, S.H.A.</span> ; <span style=\"font-variant:small-caps;\">Klipp, A.</span> ; <span style=\"font-variant:small-caps;\">Haindl, G.</span> ; <span style=\"font-variant:small-caps;\">Hartwich, J.</span> ; <span style=\"font-variant:small-caps;\">Dreeskornfeld, L.</span> ; <span style=\"font-variant:small-caps;\">Kleineberg, U.</span> ; <span style=\"font-variant:small-caps;\">Jutzi, P.</span> ; u. a.</span>: W/Si multilayers deposited by hot-filament MOCVD. In: <i>Thin Solid Films</i> Bd. 338, Elsevier BV (1999), Nr. 1–2, S. 70–74","bibtex":"@article{Hamelmann_Petri_Klipp_Haindl_Hartwich_Dreeskornfeld_Kleineberg_Jutzi_Heinzmann_1999, title={W/Si multilayers deposited by hot-filament MOCVD}, volume={338}, DOI={<a href=\"https://doi.org/10.1016/S0040-6090(98)00996-1\">10.1016/S0040-6090(98)00996-1</a>}, number={1–2}, journal={Thin Solid Films}, publisher={Elsevier BV}, author={Hamelmann, Frank and Petri, S.H.A. and Klipp, A. and Haindl, G. and Hartwich, J. and Dreeskornfeld, L. and Kleineberg, U. and Jutzi, P. and Heinzmann, U.}, year={1999}, pages={70–74} }","mla":"Hamelmann, Frank, et al. “W/Si Multilayers Deposited by Hot-Filament MOCVD.” <i>Thin Solid Films</i>, vol. 338, no. 1–2, Elsevier BV, 1999, pp. 70–74, doi:<a href=\"https://doi.org/10.1016/S0040-6090(98)00996-1\">10.1016/S0040-6090(98)00996-1</a>.","ama":"Hamelmann F, Petri SHA, Klipp A, et al. W/Si multilayers deposited by hot-filament MOCVD. <i>Thin Solid Films</i>. 1999;338(1-2):70-74. doi:<a href=\"https://doi.org/10.1016/S0040-6090(98)00996-1\">10.1016/S0040-6090(98)00996-1</a>"},"user_id":"216459","_id":"3553","status":"public","publisher":"Elsevier BV","author":[{"first_name":"Frank","id":"208487","full_name":"Hamelmann, Frank","last_name":"Hamelmann"},{"last_name":"Petri","full_name":"Petri, S.H.A.","first_name":"S.H.A."},{"last_name":"Klipp","full_name":"Klipp, A.","first_name":"A."},{"last_name":"Haindl","full_name":"Haindl, G.","first_name":"G."},{"last_name":"Hartwich","full_name":"Hartwich, J.","first_name":"J."},{"last_name":"Dreeskornfeld","full_name":"Dreeskornfeld, L.","first_name":"L."},{"first_name":"U.","full_name":"Kleineberg, U.","last_name":"Kleineberg"},{"first_name":"P.","full_name":"Jutzi, P.","last_name":"Jutzi"},{"last_name":"Heinzmann","full_name":"Heinzmann, U.","first_name":"U."}],"issue":"1-2","volume":338,"doi":"10.1016/S0040-6090(98)00996-1","type":"journal_article","publication_identifier":{"issn":["00406090"]},"date_updated":"2023-09-01T10:22:01Z","page":"70-74","language":[{"iso":"eng"}],"intvolume":"       338"}