{"publication_status":"published","year":"2000","publication":"Journal of Applied Physics","date_created":"2023-03-24T13:13:01Z","title":"Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers","user_id":"245590","citation":{"mla":"Heitmann, S., et al. “Interplay of Antiferromagnetic Coupling in Copper/Permalloy Combination Multilayers.” <i>Journal of Applied Physics</i>, vol. 87, no. 9, AIP Publishing, 2000, pp. 4849–51, doi:<a href=\"https://doi.org/10.1063/1.373179\">10.1063/1.373179</a>.","ama":"Heitmann S, Hütten A, Hempel T, Schepper W, Reiss G, Alof C. Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers. <i>Journal of Applied Physics</i>. 2000;87(9):4849-4851. doi:<a href=\"https://doi.org/10.1063/1.373179\">10.1063/1.373179</a>","bibtex":"@article{Heitmann_Hütten_Hempel_Schepper_Reiss_Alof_2000, title={Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers}, volume={87}, DOI={<a href=\"https://doi.org/10.1063/1.373179\">10.1063/1.373179</a>}, number={9}, journal={Journal of Applied Physics}, publisher={AIP Publishing}, author={Heitmann, S. and Hütten, A. and Hempel, T. and Schepper, W. and Reiss, G. and Alof, C.}, year={2000}, pages={4849–4851} }","ieee":"S. Heitmann, A. Hütten, T. Hempel, W. Schepper, G. Reiss, and C. Alof, “Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers,” <i>Journal of Applied Physics</i>, vol. 87, no. 9, pp. 4849–4851, 2000.","chicago":"Heitmann, S., A. Hütten, T. Hempel, W. Schepper, G. Reiss, and C. Alof. “Interplay of Antiferromagnetic Coupling in Copper/Permalloy Combination Multilayers.” <i>Journal of Applied Physics</i> 87, no. 9 (2000): 4849–51. <a href=\"https://doi.org/10.1063/1.373179\">https://doi.org/10.1063/1.373179</a>.","apa":"Heitmann, S., Hütten, A., Hempel, T., Schepper, W., Reiss, G., &#38; Alof, C. (2000). Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers. <i>Journal of Applied Physics</i>, <i>87</i>(9), 4849–4851. <a href=\"https://doi.org/10.1063/1.373179\">https://doi.org/10.1063/1.373179</a>","alphadin":"<span style=\"font-variant:small-caps;\">Heitmann, S.</span> ; <span style=\"font-variant:small-caps;\">Hütten, A.</span> ; <span style=\"font-variant:small-caps;\">Hempel, T.</span> ; <span style=\"font-variant:small-caps;\">Schepper, W.</span> ; <span style=\"font-variant:small-caps;\">Reiss, G.</span> ; <span style=\"font-variant:small-caps;\">Alof, C.</span>: Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers. In: <i>Journal of Applied Physics</i> Bd. 87, AIP Publishing (2000), Nr. 9, S. 4849–4851","short":"S. Heitmann, A. Hütten, T. Hempel, W. Schepper, G. Reiss, C. Alof, Journal of Applied Physics 87 (2000) 4849–4851."},"_id":"2685","status":"public","publisher":"AIP Publishing","issue":"9","extern":"1","author":[{"last_name":"Heitmann","full_name":"Heitmann, S.","first_name":"S."},{"last_name":"Hütten","full_name":"Hütten, A.","first_name":"A."},{"first_name":"T.","full_name":"Hempel, T.","last_name":"Hempel"},{"last_name":"Schepper","full_name":"Schepper, W.","first_name":"W."},{"first_name":"G.","full_name":"Reiss, G.","last_name":"Reiss"},{"first_name":"C.","full_name":"Alof, C.","last_name":"Alof"}],"doi":"10.1063/1.373179","volume":87,"type":"journal_article","publication_identifier":{"eissn":["1089-7550"],"issn":["0021-8979"]},"page":"4849-4851","date_updated":"2023-03-24T19:36:39Z","intvolume":"        87","language":[{"iso":"eng"}]}